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INTEGRATED CIRCUITS
DATA SHEET
74ALVC14 Hex inverting Schmitt trigger
Product specification 2003 Feb 03
Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
FEATURES * Wide supply voltage range from 1.65 to 3.6 V * Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V). * 3.6 V tolerant inputs/outputs * CMOS low power consumption * Direct interface with TTL levels (2.7 to 3.6 V) * Power-down mode * Unlimited input rise and fall times * Latch-up performance exceeds 250 mA * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C. SYMBOL tPHL/tPLH PARAMETER propagation delay input nA to output nY CONDITIONS VCC = 1.8 V; CL = 30 pF; RL = 1 k VCC = 2.5 V; CL = 30 pF; RL = 500 VCC = 2.7 V; CL = 50 pF; RL = 500 VCC = 3.3 V; CL = 50 pF; RL = 500 CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. input capacitance power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2 DESCRIPTION
74ALVC14
The 74ALVC14 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. The 74ALVC14 provides six inverting buffers with Schmitt-trigger action. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
TYPICAL 2.9 2.2 2.8 2.4 3.5 25
UNIT ns ns ns ns pF pF
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
ORDERING INFORMATION PACKAGE TYPE NUMBER PINS 74ALVC14D 74ALVC14PW FUNCTION TABLE See note 1. INPUT nA L H Note 1. H = HIGH voltage level; L = LOW voltage level. PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC SYMBOL data input data output data input data output data input data output ground (0 V) data output data input data output data input data output data input supply voltage DESCRIPTION OUTPUT nY H L 14 14 PACKAGE SO14 TSSOP14 MATERIAL plastic plastic
74ALVC14
CODE SOT108-1 SOT402-1
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
74ALVC14
handbook, halfpage
1A 1Y 2A 2Y 3A 3Y GND
1 2 3 4 5 6 7
MNA203
14 VCC 13 6A 12 6Y
14
11 5A
handbook, halfpage
10 5Y 9 4A
A
Y
MNA205
8 4Y
Fig.1 Pin configuration.
Fig.2 Logic diagram (one Schmitt-trigger).
handbook, halfpage
1
1A
1Y
2
3
2A
2Y
4
5
3A
3Y
6
9
4A
4Y
8
11
5A
5Y
10
13
6A
6Y
12
MNA204
Fig.3 Logic symbol.
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times VCC = 1.65 to 2.7 V VCC = 2.7 to 3.6 V VCC = 1.65 to 3.6 V VCC = 0 V; Power-down mode CONDITIONS 0 0 0 -40 0 0 MIN. 1.65 3.6 3.6 VCC 3.6 +85 20 10
74ALVC14
MAX. V V V V
UNIT
C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg Ptot PARAMETER supply voltage input diode current input voltage output diode current output voltage output source or sink current VCC or GND current storage temperature power dissipation SO package TSSOP package Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation. above 70 C derate linearly with 8 mW/K above 60 C derate linearly with 5.5 mW/K - - 500 500 mW mW VO > VCC or VO < 0 notes 1 and 2 Power-down mode; note 2 VO = 0 to VCC VI < 0 CONDITIONS - -0.5 - -0.5 -0.5 - - -65 MIN. -0.5 MAX. +4.6 -50 +4.6 50 VCC + 0.5 +4.6 50 100 +150 V mA V mA V V mA mA C UNIT
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +85 C VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 6 mA IO = 12 mA IO = 18 mA IO = 12 mA IO = 18 mA IO = 24 mA VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A IO = -6 mA IO = -12 mA IO = -18 mA IO = -12 mA IO = -18 mA IO = -24 mA ILI Ioff ICC ICC input leakage current power OFF leakage current quiescent supply current additional quiescent supply current per input pin VI = 3.6 V or GND VI or VO = 3.6 V VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0 1.65 to 3.6 1.65 2.3 2.3 2.7 3.0 3.0 3.6 0.0 3.6 3.0 to 3.6 VCC - 0.2 - 1.25 1.8 1.7 2.2 2.4 2.2 - - - - 1.51 2.10 2.01 2.53 2.76 2.68 0.1 0.1 0.2 5 - - - - - - - 1.65 to 3.6 1.65 2.3 2.3 2.7 3.0 3.0 - - - - - - - - 0.11 0.17 0.25 0.16 0.23 0.30 VCC (V) MIN. TYP.(1)
74ALVC14
MAX.
UNIT
0.2 0.3 0.4 0.6 0.4 0.4 0.55
V V V V V V V V V V V V V V A A A A
5 10 10 750
Note 1. All typical values are measured at Tamb = 25 C.
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
TRANSFER CHARACTERISTICS Voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C VT+ positive-going threshold see Figs 4 and 5 1.65 1.95 2.3 2.7 3.0 3.6 VT- negative-going threshold see Figs 4 and 5 1.65 1.95 2.3 2.7 3.0 3.6 VH hysteresis (VT+ - VT-) see Figs 4 and 5 1.65 1.95 2.3 2.7 3.0 3.6 Notes 1. All typical values are measured at Tamb = 25 C. 2. The VIH and VIL from the DC family characteristics are superseded by the VT+ and VT-. 0.7 0.75 0.9 1.0 1.1 1.1 0.41 0.49 0.6 0.7 0.8 0.8 0.25 0.25 0.3 0.3 0.3 0.3 0.98 1.12 1.27 1.43 1.56 1.81 0.64 0.76 0.90 1.06 1.19 1.42 0.34 0.36 0.36 0.38 0.37 0.40 VCC (V) MIN. TYP.(1)
74ALVC14
MAX.
UNIT
1.24 1.46 1.7 2.0 2.0 2.0 0.9 1.1 1.3 1.4 1.5 1.7 0.62 0.62 1.0 1.1 1.2 1.2
V V V V V V V V V V V V V V V V V V
handbook, halfpage handbook, halfpage
VO
VI
VT+ VT-
VH
VO
MNA208
VH VT- VT+
VI
MNA026
Where VT+ and VT- are between limits of 20% and 70%.
Fig.4 Transfer characteristic.
Fig.5 Definition of VT+, VT- and VH
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
74ALVC14
handbook, halfpage
5
MNA582
I CC (mA)
4
3
2
1
0 0 0.6 1.2 1.8 2.4 Vin (V) 3
VCC = 3.0 V.
Fig.6 Typical 74ALVC14 transfer characteristic
AC CHARACTERISTICS TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C tPHL/tPLH propagation delay nA to nY see Figs 7 and 8 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 Note 1. All typical values are measured at Tamb = 25 C. 1.0 1.0 1.0 1.0 2.9 2.2 2.8 2.4 4.4 3.7 3.9 3.4 ns ns ns ns VCC (V) MIN. TYP.(1) MAX. UNIT
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
AC WAVEFORMS
74ALVC14
handbook, halfpage
nA input
VM
tPHL
tPLH
nY output
VM
MNA209
INPUT VCC 1.65 to 1.95 V 2.3 to 2.7 V 2.7 V 3.0 to 3.6 V VM VI tr = tf 2.0 ns 2.0 ns 2.5 ns 2.5 ns 0.5 x VCC VCC 0.5 x VCC VCC 1.5 V 1.5 V 2.7 V 2.7 V
Fig.7 Input nA to output nY propagation delay times.
handbook, full pagewidth
VEXT VCC PULSE GENERATOR VI D.U.T. RT CL RL VO RL
MNA616
VCC 1.65 to 1.95 V 2.3 to 2.7 V 2.7 V 3.0 to 3.6 V
VI VCC VCC 2.7 V 2.7 V
CL 30 pF 30 pF 50 pF 50 pF
RL 1 k 500 500 500
VEXT tPLH/tPHL tPZH/tPHZ open open open open GND GND GND GND tPZL/tPLZ 2 x VCC 2 x VCC 6V 6V
RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
APPLICATION INFORMATION
74ALVC14
handbook, halfpage
2.5
MNA581
average I CC (mA) 2.0 positive-going edge
handbook, halfpage
R
1.5
1.0
negative-going edge
C
MNA035
0.5 2.1
2.4
2.7
3.0
3.3
3.6 VCC (V)
3.9 1 1 f = -- ---------------------T 0.8 x RC
Linear change of VI between 0.8 to 2.0 V. All values given are typical unless otherwise specified.
VCC = 3.0 V.
Fig.9
Average ICC for ALVC Schmitt-trigger devices.
Fig.10 Relaxation oscillator using the ALVC14.
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm
74ALVC14
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.050 0.041 0.228 0.016
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
74ALVC14
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74ALVC14
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3)
74ALVC14
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 Feb 03
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Philips Semiconductors
Product specification
Hex inverting Schmitt trigger
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
74ALVC14
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/01/pp16
Date of release: 2003
Feb 03
Document order number:
9397 750 10452

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